Experience in Additive Technology
Fine Feature with LPBF Quality
×4 Laser | ×3 Power | ×3 Volume compared to standard SLS
Build Envelope: 1000 x 500 x 450 mm
Powerful quad fiber laser configuration
Ultra-fast scanning speed up to 20 m/s
Ultimate system for production
High temperature capable
Enhanced material capabilities
Industry-leading build volume
Build Envelope: 1000 x 500 x 450 mm
Designed for continuous production
High throughput and expanded build size
High temperature capable
Top-feed, closed-loop powder system
Truly open and modular
x4 Laser | Large-format Polymer LPBF system for high volume serial production
Build Envelope:600 x 600 x 600 mm
Highly efficient quad laser configuration
Ultra-fast fiber laser technology
Designed for continuous production
High-temperature material capability
Reduced cost per part
In pursuit of series production of high-quality parts at an extremely attractive prices, Farsoon has keep innovating on the flagship medium-sized platform that are versatile and robust. The latest application of Flight Technology leads to a more powerful and improved throughput for commercialized production.
The next generation of high-speed plastic laser sintering
Build Envelope: 400 × 400 × 540 mm
Equipped with powerful fiber lasers
High production speed and yield
Fine detail resolution
High temperature capable
Maximized Production Speed & Turn-over Rate
Build Envelope:400 × 400 × 540 mm
Robust Dual fiber lasers.
Highest Productivity.
True economy AM production.
High temperature capable.
A powerful Series Production Tool with great ROI
Build Envelope:400 × 400 × 540 mm
Industrial build volume & production speed
Quality & accurate parts.
High-temperature capable.
Truly open production platform.
Powerful & Flexible Platform for High-temp Applications
Build Envelope:250 × 250 × 320 mm
Robust fiber laser innovation.
Super temperature capability up to 280°C.
Truly open parameter platform.
Powerful platform for material development.
Improved cost-performance ratio.
Ultra Temperature & Compact Industrial AM Platform
Build Envelope:250 × 250 × 320 mm
Ultra temperature capability up to 340°C.
Open platform enabling a wide range of material operation.
Perfect platform for material development.
Compact & ease of use.
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